www.roithner - laser.com 1 smb1n - 74 0 d - 02 v 1. 1 17 . 0 7 .201 4 description smb1n - 74 0 d - 02 is a surface mount algaas high power led with a typical peak wavelength of 74 0 nm and radiation of 29 0 mw . it comes in smd package (pa9t) with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin. maximum ratings (t case =25c) parameter symbol values min. max. unit power dissipation p d 20 00 mw forward current i f 8 0 0 ma pulse forward current * 1 i f p 20 00 ma reverse voltage v f 5 v thermal resistance r thja 10 k/w junction temperature t j 1 2 0 c operating temperature t case - 4 0 + 100 c storage temperature t stg - 40 + 100 c lead solder temperature * 2 t sld + 25 0 c * 1 duty=1%, pulse width = 10 s * 2 must be completed within 5 seconds electro - optical characteristics (t case =25c) * 1 measured by s3584 - 08 * 2 measured by cie127 - 2007 condition b parameter symbol conditions values min. typ. max. unit peak wavelength p i f = 600ma 73 0 74 0 75 0 nm half width ? i f = 600ma 2 7 nm forward voltage v f i f = 600ma 2. 0 2.4 v v f p i f p =2a 2.7 radiated power * 1 p o i f = 600ma 29 0 mw i f p =2a 96 0 radiant intensity * 2 i e i f = 600ma 62 0 mw/sr i f p =2a 205 0 viewing angle i f =100ma 16 deg. rise time t r i f = 600ma 90 n s fall time t f i f = 600ma 9 0 ns
www.roithner - laser.com 2 typical performance curves forward current vs. forward voltage rel. radiant i ntensity vs. forward current forward current vs. pulse duration a llowed forward current vs. ambient temperature forward voltage vs. ambient temperature rel. radiant i ntensity vs. ambient temperature
www.roithner - laser.com 3 outline dimensions all dimensions in mm peak wavelength vs. ambient temperature relative spectral emission radiation characteristics smb1n lens lead description pin a1 led anode pin c1 led cathode
www.roithner - laser.com 4 precautions soldering: ? do avoid overheating of the led ? do avoid electrostatic discharge (esd) ? do avoid mechanical stress, shock, and vibration ? do only use non - corrosive flux ? do not apply current to the led until it has cooled down to room temperature after soldering recommended soldering conditions: this l ed is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, its reliability cannot be guarantee. nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere . ir reflow soldering profile (lead - free solder) recommended soldering patterns unit: mm above table specifies the maximum allowed duration and temperature during soldering. it is strongly advised to perform soldering at the shortest time and lowest temperature possible. cleaning: cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended do not use acetone, chloroseen, trichloroethylene, or mks do not use ultrasonic cleaners static electricity: leds are sensitive to electrostat ic discharge (esd) . precautions against esd must be taken when handling or operating these leds. surge voltage or electrostatic discharge can result in complete failure of the device. radiation : during operation these leds do emit high intensity light , which is hazardous to skin and eyes, and may cause cancer. do avoid exposure to the emitted light. protective glasses are recommended . it is further advised to attach a warning label on products/systems. operation : do only operate leds with a current so urce. running these leds from a voltage source will result in complete failure of the device. current of a led is an exponential function of the voltage across it. usage of current regulated drive circuits is mandatory. ? all rights reserved the above specifications are for reference purpose only and subjected to change without prior notice
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